Industry Directory | Manufacturer
Suppliers of solder pastes, wave soldering liquid fluxes and SMT adhesives and cored solder wires for all soldering requirements.
Industry Directory | Manufacturer / Manufacturer's Representative
Smart SMT is a solutions rep in Canada selling Heller, Hitachi, Stoelting, MB Tech cleaners,KJ Marketing stencils and micro-machining. We are also sell Koki solder pastes & adhesives in Canada & US N.
All kinds of ELECTRONICS trading & SMT manufacturing in both HK & China! We are sole agent of USA SMarT Sonic SMT stencil cleaning system in both HK & China! Also we rep Phoenix X Ray inspection in among PCB, PCBA, BGA, IC, SMarT Sonic AOI, Koki SMT
All kinds of ELECTRONICS trading & SMT manufacturing in both HK & China! We are sole agent of USA SMarT Sonic SMT stencil cleaning system in both HK & China! Also we rep Phoenix X Ray inspection in among PCB, PCBA, BGA, IC, SMarT Sonic AOI, Koki SMT
Electronics Forum | Fri May 12 10:26:28 EDT 2017 | capse
I'm the Rep for KOKI in the southeast. They offer solder paste with a type R flux. You can call Shantanu Joshi (760-504-2544) for details.
Electronics Forum | Fri Feb 23 09:35:36 EST 2024 | emanuel
We have the standard profile as a template made according to the solder paste specs. For some boards we measure the result at 2 points, on the board itself and on top of a sensitive SOT263 module and adjust accordingly. The solder paste is well kept,
Industry News | 2010-01-22 21:46:55.0
Minneapolis, MN - The SMTA is pleased to announce several new online presentations coming up in February. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.
Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Career Center | Derabassi, India | Maintenance,Management,Production,Quality Control,Sales/Marketing
PCB Assembly (SMT & PTH)--Process/Planning – Production – Maintenance/Troubleshooting – QA/QC
Career Center | Poplar Grove, Illinois | Engineering,Production,Quality Control,Technical Support
Please see resume.
SMTnet Express, March 06, 2014, Subscribers: 22524, Members: Companies: 13810, Users: 35835 Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. Jasbir Bath, Roberto Garcia
SMTnet Express, January 10, 2019, Subscribers: 31,583, Companies: 10,684, Users: 25,588 An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications Credits: Koki Company LTD The electronics industry has
